What is LED Package (High Power)
An LED Package (High Power) is a packaging technology for high-power LED chips. This technology, known as Chip On Board (COB), involves directly attaching the LED chip to a Printed Circuit Board (PCB) using glue or solder, with the electrical connection established through wire bonding. The PCB can be made of low-cost FR-4 material or high thermal conductivity materials like aluminum substrates or copper clad ceramic substrates.
COB technology is primarily employed for packaging high-power multi-chip arrays, allowing for the integration of multiple LED chips within a single package. This integration enhances brightness while reducing the required input current for each individual LED chip, resulting in improved efficiency. Additionally, COB packages feature a larger heat dissipation area, facilitating better heat transfer to the housing and, consequently, lower thermal resistance and enhanced overall performance.
Compared to alternative packaging technologies like Surface Mount Device (SMD), COB technology offers advantages such as higher power density, lower thermal resistance (typically 6-12W/mK), and improved cost-effectiveness. As a result, it is considered the mainstream direction for future luminaire design, offering high efficiency, good light quality, and cost savings.