什么是 LED 封装（大功率）
LED 封装（大功率）是一种用于大功率 LED 芯片的封装技术。这种被称为板上芯片（COB）的技术是用胶水或焊料将 LED 芯片直接粘贴到印刷电路板（PCB）上，并通过接线建立电气连接。印刷电路板可以由低成本的 FR-4 材料或高导热材料制成，如铝基板或覆铜陶瓷基板。
COB 技术主要用于封装大功率多芯片阵列，可在单个封装内集成多个 LED 芯片。这种集成增强了 亮度 同时降低了每个 LED 芯片所需的输入电流，从而提高了效率。此外，COB 封装具有更大的散热面积，有助于更好地将热量传导至 LED 芯片。 外殼 从而降低热阻，提高整体性能。
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- 延遲時間 15 秒–30 分鐘
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- 高/低感度
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- 日/夜模式
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与表面贴装器件（SMD）等替代封装技术相比，COB 技术具有功率密度更高、热阻更低（通常为 6-12W/mK）、成本效益更高等优势。因此，它被认为是未来的主流方向。 灯具设计该系统效率高、光质好、成本低。
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